HANA Micron Inc.

HANA Micron Inc. provides semiconductor back-end process packaging solutions in South Korea. The company offers packaging products, such as flip chips, laminated, lead frames, and wafer level packages; test solution that covers wafer test, package test, and module test; test platforms to serve various applications including SOC, RF, PMIC, Sensor, etc.; and test IT system that provide its customers a production management system, real-time process monitoring, data analysis system, and web reports, as well as electrical test and visual inspection. It also provides bumping solutions comprising various package solutions with wafer bumping such as WLCSP, FLIP CHIP, SiP, and FCQFN; and engineering solutions. The company was founded in 2001 and is headquartered in Asan-Si, South Korea.